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| Presentation | 2005-09-09 11:20 Development of New Surface Finish Technology for Package Substrates with Excellent Bondability Kiyotaka Tsukada (IBIDEN) Link to ES Tech. Rep. Archives:  CPM2005-100 ICD2005-110 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | This Paper describes the characteristics, development, and application of the surface finish technologies for chip packaging substrates. In particular, electroless Nickel/Palladium/Gold is discussed.The Palladium layer of this surface finish contains 5-7% of phosphorus and the crystal structure is minute and rigid. Both Wire-bondability after high temperature storage and solderability using lead-free solder are investigated. Results show this surface finish method has good wire bondability and excellent solderability similar to the conventional electrolytic Nickel/Gold surface finish. Also, the Palladium layer effectively inhibits the diffusion of Nickel metal from the barrier layer. In addition, this surface finish technology makes plating bus lines unnecessary and increases design flexibility for packaging substrates allowing continued size reduction of packages and decreases in the electrical noises. This technology can be applied for the high performance SiP(System in a Package) and MCM(Multi Chip Module) etc. |
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| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Package / Electroless Plating / Wire Bondable / Lead Free Solder Joint / System in a Package / Reliability / / | |
| Reference Info. | IEICE Tech. Rep., vol. 105, no. 268, ICD2005-110, pp. 23-27, Sept. 2005. | |
| Paper # | ICD2005-110 | |
| Date of Issue | 2005-09-02 (CPM, ICD) | |
| ISSN | Print edition: ISSN 0913-5685 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | Link to ES Tech. Rep. Archives: CPM2005-100 ICD2005-110 |
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| Conference Information | |
| Committee | ICD CPM |
| Conference Date | 2005-09-08 - 2005-09-09 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | ICD |
| Conference Code | 2005-09-ICD-CPM |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of New Surface Finish Technology for Package Substrates with Excellent Bondability |
| Sub Title (in English) | |
| Keyword(1) | Package |
| Keyword(2) | Electroless Plating |
| Keyword(3) | Wire Bondable |
| Keyword(4) | Lead Free Solder Joint |
| Keyword(5) | System in a Package |
| Keyword(6) | Reliability |
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| Keyword(8) | |
| 1st Author's Name | Kiyotaka Tsukada |
| 1st Author's Affiliation | IBIDEN CO.Ltd (IBIDEN) |
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| Speaker | Author-1 |
| Date Time | 2005-09-09 11:20:00 |
| Presentation Time | 25 minutes |
| Registration for | ICD |
| Paper # | CPM2005-100, ICD2005-110 |
| Volume (vol) | vol.105 |
| Number (no) | no.266(CPM), no.268(ICD) |
| Page | pp.23-27 |
| #Pages | 5 |
| Date of Issue | 2005-09-02 (CPM, ICD) |
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