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| Presentation | 2005-09-09 10:55 Lead-free bumping and its process integrity for fine pitch interconnects Hirokazu Ezawa, Masaharu Seto, Kazuhito Higuchi (Toshiba) Link to ES Tech. Rep. Archives:  CPM2005-99 ICD2005-109 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | Electroplated solder bumps allow much finer pitch interconnection for high I/O applications, although controlling the alloy deposition is challenging. To overcome problems concerning alloy plating, we have developed the Pb-free bumping process to employ multi-stack electroplating and it has been qualified to exhibit wide versatility of solder materials and compositions. In this study, from the reliability viewpoint of solder joints, the integrity of the stack plating process is discussed. Emphasis is placed on void formation in the stack-plated bumps. |
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| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Lead-free / bumping / electroplating / void / degassing / Sn based alloy / / | |
| Reference Info. | IEICE Tech. Rep., vol. 105, no. 266, CPM2005-99, pp. 17-22, Sept. 2005. | |
| Paper # | CPM2005-99 | |
| Date of Issue | 2005-09-02 (CPM, ICD) | |
| ISSN | Print edition: ISSN 0913-5685 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | Link to ES Tech. Rep. Archives: CPM2005-99 ICD2005-109 |
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| Conference Information | |
| Committee | ICD CPM |
| Conference Date | 2005-09-08 - 2005-09-09 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kikai-Shinko-Kaikan Bldg. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | CPM |
| Conference Code | 2005-09-ICD-CPM |
| Language | English (Japanese title is available) |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Lead-free bumping and its process integrity for fine pitch interconnects |
| Sub Title (in English) | |
| Keyword(1) | Lead-free |
| Keyword(2) | bumping |
| Keyword(3) | electroplating |
| Keyword(4) | void |
| Keyword(5) | degassing |
| Keyword(6) | Sn based alloy |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Hirokazu Ezawa |
| 1st Author's Affiliation | Toshiba Semiconductor Company (Toshiba) |
| 2nd Author's Name | Masaharu Seto |
| 2nd Author's Affiliation | Toshiba Semiconductor Company (Toshiba) |
| 3rd Author's Name | Kazuhito Higuchi |
| 3rd Author's Affiliation | Toshiba Corporate Manufacturing Engineering Center (Toshiba) |
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| Speaker | Author-1 |
| Date Time | 2005-09-09 10:55:00 |
| Presentation Time | 25 minutes |
| Registration for | CPM |
| Paper # | CPM2005-99, ICD2005-109 |
| Volume (vol) | vol.105 |
| Number (no) | no.266(CPM), no.268(ICD) |
| Page | pp.17-22 |
| #Pages | 6 |
| Date of Issue | 2005-09-02 (CPM, ICD) |
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