Paper Abstract and Keywords |
Presentation |
2005-08-19 10:00
[Special Invited Talk]
HfSiON
-- its high applicability as the alternative gate dielectric based on the high thermal stability and the remaining issue -- Akira Nishiyama, Masato Koyama, Yuuichi Kamimuta, Masahiro Koike, Ryosuke Iijima, Takeshi Yamaguchi, Masamichi Suzuki, Tsunehiro Ino, Mizuki Ono (Toshiba) Link to ES Tech. Rep. Archives: SDM2005-146 ICD2005-85 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The decrease in the MOS device size has long been requiring the thinning of its gate dielectrics. In order to suppress the dramatic increase in the gate leakage current due to the quantum-mechanical tunneling through the ultra-thin SiON, new materials (high-k) has long been investigated. In this report, we describe the advantages of the Hf containing material, especially nitrided Hf-silicate as the thermally stable high-k gate dielectric. We also mention some issues left for its application to real LSIs as well. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
MOS / LSI / thermal stability / high permittivity / gate dielectric / phase separation / leakage current / |
Reference Info. |
IEICE Tech. Rep., vol. 105, no. 233, SDM2005-146, pp. 19-24, Aug. 2005. |
Paper # |
SDM2005-146 |
Date of Issue |
2005-08-12 (SDM, ICD) |
ISSN |
Print edition: ISSN 0913-5685 |
Copyright and reproduction |
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Link to ES Tech. Rep. Archives: SDM2005-146 ICD2005-85 |
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