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| Presentation | 2005-05-27 15:10 A 195Gb/s 1.2W 3D-Stacked Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme Noriyuki Miura, Daisuke Mizoguchi, Mari Inoue (Keio Univ.), Takayasu Sakurai (Univ. of Tokyo), Tadahiro Kuroda (Keio Univ.) Link to ES Tech. Rep. Archives:  ICD2005-36 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | A wireless interface by inductive coupling achieves aggregate data rate of 195Gb/s among 4 stacked chips in a package by arranging 195 transceivers in 50m pitch with power dissipation of 1.2W. A transmit power is controlled in accordance with communications distance to reduce not only power dissipation but also cross talk. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | wireless bus / inductor / high bandwidth / low power / SiP / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 105, no. 96, ICD2005-36, pp. 45-50, May 2005. | |
| Paper # | ICD2005-36 | |
| Date of Issue | 2005-05-20 (ICD) | |
| ISSN | Print edition: ISSN 0913-5685 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | Link to ES Tech. Rep. Archives: ICD2005-36 |
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| Conference Information | |
| Committee | ICD |
| Conference Date | 2005-05-26 - 2005-05-27 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kobe Univ. |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Paper Information | |
| Registration To | ICD |
| Conference Code | 2005-05-ICD |
| Language | Japanese |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A 195Gb/s 1.2W 3D-Stacked Inductive Inter-Chip Wireless Superconnect with Transmit Power Control Scheme |
| Sub Title (in English) | |
| Keyword(1) | wireless bus |
| Keyword(2) | inductor |
| Keyword(3) | high bandwidth |
| Keyword(4) | low power |
| Keyword(5) | SiP |
| Keyword(6) | |
| Keyword(7) | |
| Keyword(8) | |
| 1st Author's Name | Noriyuki Miura |
| 1st Author's Affiliation | Keio University (Keio Univ.) |
| 2nd Author's Name | Daisuke Mizoguchi |
| 2nd Author's Affiliation | Keio University (Keio Univ.) |
| 3rd Author's Name | Mari Inoue |
| 3rd Author's Affiliation | Keio University (Keio Univ.) |
| 4th Author's Name | Takayasu Sakurai |
| 4th Author's Affiliation | University of Tokyo (Univ. of Tokyo) |
| 5th Author's Name | Tadahiro Kuroda |
| 5th Author's Affiliation | Keio University (Keio Univ.) |
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| Speaker | Author-3 |
| Date Time | 2005-05-27 15:10:00 |
| Presentation Time | 30 minutes |
| Registration for | ICD |
| Paper # | ICD2005-36 |
| Volume (vol) | vol.105 |
| Number (no) | no.96 |
| Page | pp.45-50 |
| #Pages | 6 |
| Date of Issue | 2005-05-20 (ICD) |
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