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Paper Abstract and Keywords
Presentation 2005-01-27 16:45
The Study of An-Ag-X Lead Free Solders for High Reliability
Masazumi Amagai (TI Japan), Tsukasa Ohnishi, (SMI) Link to ES Tech. Rep. Archives: CPM2004-161 ICD2004-206
Abstract (in Japanese) (See Japanese page) 
(in English) (Not available yet)
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Reference Info. IEICE Tech. Rep., vol. 104, no. 626, CPM2004-161, pp. 35-38, Jan. 2005.
Paper # CPM2004-161 
Date of Issue 2005-01-20 (CPM, ICD) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee ICD CPM  
Conference Date 2005-01-27 - 2005-01-28 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To CPM 
Conference Code 2005-01-ICD-CPM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) The Study of An-Ag-X Lead Free Solders for High Reliability 
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1st Author's Name Masazumi Amagai  
1st Author's Affiliation Texas Instruments, Japan (TI Japan)
2nd Author's Name Tsukasa Ohnishi  
2nd Author's Affiliation Senju Metal Industrry (SMI)
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3rd Author's Affiliation Senju Metal Industrry (SMI)
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Speaker
Date Time 2005-01-27 16:45:00 
Presentation Time 30 
Registration for CPM 
Paper # IEICE-CPM2004-161,IEICE-ICD2004-206 
Volume (vol) IEICE-104 
Number (no) no.626(CPM), no.628(ICD) 
Page pp.35-38 
#Pages IEICE-4 
Date of Issue IEICE-CPM-2005-01-20,IEICE-ICD-2005-01-20 


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