{"id":11703,"date":"2025-03-03T10:00:00","date_gmt":"2025-03-03T01:00:00","guid":{"rendered":"https:\/\/www11.ieice.org\/cs\/ap\/wp\/?p=11703"},"modified":"2025-03-03T10:17:50","modified_gmt":"2025-03-03T01:17:50","slug":"ap-net_1747","status":"publish","type":"post","link":"https:\/\/www.ieice.org\/cs\/ap\/ap-net\/ap-net_1747\/","title":{"rendered":"[AP-NET 1747] 2025 IEEE International Symposium on Radio-Frequency Integration Technology(RFIT 2025)\u8ad6\u6587\u52df\u96c6(\u7de0\u52073\u670814\u65e5)"},"content":{"rendered":"

AP-NET\u3054\u8cfc\u8aad\u306e\u7686\u69d8<\/p>\n

\u5e73\u7d20\u3088\u308aAP\u7814\u306e\u6d3b\u52d5\u306b\u3054\u5354\u529b\u9802\u304d\u307e\u3057\u3066\u611f\u8b1d\u3044\u305f\u3057\u307e\u3059\uff0e
\nIEEE RFIT2025\u306b\u95a2\u3059\u308b\u60c5\u5831\u3092\u304a\u77e5\u3089\u305b\u3044\u305f\u3057\u307e\u3059\uff0e
\n\u8a73\u7d30\u306f\u4e0b\u8a18\u3092\u3054\u89a7\u304f\u3060\u3055\u3044\uff0e<\/p>\n

———–
\nIEEE RFIT2025\u306f\u30012025\u5e748\u670825\u65e5\uff5e27\u65e5\u306b\u9e7f\u5150\u5cf6\u3067\u958b\u50ac\u3055\u308c\u307e\u3059\u3002
\n\u73fe\u5728\u3001\u4ee5\u4e0b\u306e\u6280\u8853\u5206\u91ce\u3092\u542b\u3080\u8ad6\u6587\u3092\u52df\u96c6\u3057\u3066\u3044\u307e\u3059\u306e\u3067\u3001\u662f\u975e\u3001\u6295\u7a3f\u3092\u3054\u691c\u8a0e\u304f\u3060\u3055\u3044\u3002<\/p>\n

Call for Papers\u3001\u53ca\u3073\u6295\u7a3f\u624b\u7d9a\u304d\u306f RFIT2025\u30a6\u30a7\u30d6\u30b5\u30a4\u30c8\u3067\u78ba\u8a8d\u3001\u5b9f\u65bd\u304f\u3060\u3055\u3044
\nwww.ec.ee.es.osaka-u.ac.jp\/rfit2025\/<\/a><\/p>\n

\n\u25a0\u3000\u8ad6\u6587\u52df\u96c6\u8981\u9805\u3000\uff08\u8ad6\u6587\u6280\u8853\u5206\u91ce\uff09<\/p>\n

A. EM Field, Design and Measurement Techniques
\n– Modeling and CAD: active\/passive device modeling, CAD, EM
\nsimulation, co-simulation<\/p>\n

B. Passive Components and Packaging
\n– Packaging Technologies: 3D, chiplet, MCM, SiP, TSV, flip chip
\nassembly, wire bonding,
\n\u3000anisotropic conductive film, additive manufacturing
\n– Passive Circuits and Antennas: on-chip antennas, integrated passive
\ndevices, ferrite,
\n\u3000piezoelectric<\/p>\n

C. Active Devices and Circuits
\n– Device Technologies: CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN, MEMS,
\nreliability,
\n\u3000characterization
\n– Frequency Generation\/ Conversion ICs: VCOs, PLLs, synthesizers,
\ndividers\/multipliers\/
\n\u3000mixers
\n– Front-end RFICs: LNAs, VGAs, phase shifters, RF switches
\n– Power ICs: power amplifiers, linearization circuits, drivers<\/p>\n

D. Systems and Applications
\n– Analog and Mixed Signal ICs: ADC, DAC, comparators, filters, AGC\/VGA
\n– High-Speed Data Transceivers: wireless\/wireline\/optical
\ntransceivers, CDRs for data links.
\n– Power Transmission ICs: RFID, electromagnetic induction, wireless
\npower transmission ICs
\n– Radio Integrated Systems: IoT M2M, automotive radars, wearable
\ndevices, security,
\n\u3000biomedical and healthcare applications
\n– 5G\/B5G\/6G Systems: MIMO systems, smart radio systems, cube satellite
\nand satellite
\n\u3000communication systems
\n– RF Sensor ICs: automotive radars, wearable devices, security,
\nbiomedical and healthcare
\n\u3000applications<\/p>\n

E. Emerging Technologies
\n– Millimeter-wave and THz ICs: circuits operating at mm-wave and THz bands
\n– Emerging ICs: power management, digital RF circuits, RF BIST,
\nreconfigurable ICs, vehicle
\n\u3000electronic ICs
\n– Cryogenic technologies: cryogenic\/quantum devices and modelings,
\ncryogenic circuits,
\n\u3000systems, measurement techniques, and quantum computing
\n– AI\/Machine Learning for RF\/MW\/mmW: AI\/ML, algorithms implementations, and
\n\u3000demonstrations for: spectrum sensing; mobile edge networking; MIMO
\nand array beam
\n\u3000operations and management; design and optimization; in-situ sensing,
\ndiagnostics, control,
\n\u3000reconfiguration of MHz to THz communication and sensing circuits and systems<\/p>\n

\u25a0\u3000\u8ad6\u6587\u52df\u96c6\u8981\u9805\u3000\uff08\u30b9\u30b1\u30b8\u30e5\u30fc\u30eb\uff09
\n\u6295\u7a3f\u7de0\u5207\u30002025\u5e743\u670814\u65e5
\n\u63a1\u5426\u901a\u77e5 2025\u5e745\u6708 9\u65e5
\n\u6700\u7d42\u8ad6\u6587\u63d0\u51fa\u7de0\u5207 2025\u5e746\u670813\u65e5<\/p>\n

\u25a0\u3000\u8ad6\u6587\u52df\u96c6\u8981\u9805\u3000\uff08\u6295\u7a3f\u65b9\u6cd5\uff09
\n\u82f1\u8a9e\u539f\u7a3f3\u30da\u30fc\u30b8(\u521d\u56de\u6295\u7a3f\u53ca\u3073\u6700\u7d42\u8ad6\u6587)\u3092IEEE PDF eXpress\u69d8\u5f0f\u3067\u4f5c\u6210\u306e\u4e0a\u3001\u6295\u7a3f\u304f\u3060\u3055\u3044\u3002
\n\u306a\u304a\u3001\u63a1\u629e\u3055\u308c\u305f\u8ad6\u6587\u306f\u3001IEEE Xplore\u3078\u306e\u53ce\u9332\u5bfe\u8c61\u3068\u306a\u308a\u307e\u3059\u3002<\/p>\n

\u25a0\u3000RFIT2025\u958b\u50ac\u6982\u8981
\n\u4e3b\u50ac\uff1aIEEE MTT-S
\n\u5354\u8cdb\uff1aIEEE MTT-S Japan\/Kansai\/Nagoya Chapters
\n\u958b\u50ac\u65e5\uff1a2025\u5e748\u670825-27\u65e5
\n\u4f1a\u5834\uff1a\u57ce\u5c71\u30db\u30c6\u30eb\u9e7f\u5150\u5cf6\u3000https:\/\/www.shiroyama-g.co.jp\/
\n\u554f\u5408\u305b\u5148\uff1aShinjo.Shintaro\u2605eb.MitsubishiElectric.co.jp
\n\u3000\u3000\u3000\u3000\u3000\uff08\u2605\u3092@\u306b\u5909\u66f4\u306e\u4e0a\u3001\u3054\u9023\u7d61\u304f\u3060\u3055\u3044\uff09<\/a><\/p>\n

\u7686\u69d8\u306e\u6295\u7a3f\u30fb\u53c2\u52a0\u3092\u304a\u5f85\u3061\u3057\u3066\u304a\u308a\u307e\u3059\u3002
\n———–<\/p>\n

—
\n\u203b\u30e1\u30fc\u30eb\u306e\u8cfc\u8aad\u505c\u6b62
\nwww.ieice.org\/cs\/ap\/misc\/ap_net\/<\/a><\/p>\n

A\u30fbP\u7814\u5e79\u4e8b\u56e3\u3000ap_ac-secretary(a)mail.ieice.org<\/p>\n","protected":false},"excerpt":{"rendered":"

AP-NET\u3054\u8cfc\u8aad\u306e\u7686\u69d8 \u5e73\u7d20\u3088\u308aAP\u7814\u306e\u6d3b\u52d5\u306b\u3054\u5354\u529b\u9802\u304d\u307e\u3057\u3066\u611f\u8b1d\u3044\u305f\u3057\u307e\u3059\uff0e IEEE RFIT2025\u306b\u95a2\u3059\u308b\u60c5\u5831\u3092\u304a\u77e5\u3089\u305b\u3044\u305f\u3057\u307e\u3059\uff0e \u8a73\u7d30\u306f\u4e0b\u8a18\u3092\u3054\u89a7\u304f\u3060\u3055\u3044\uff0e ———&#8 […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"categories":[9],"tags":[],"class_list":["post-11703","post","type-post","status-publish","format-standard","hentry","category-ap-net"],"_links":{"self":[{"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/posts\/11703","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/comments?post=11703"}],"version-history":[{"count":0,"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/posts\/11703\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/media?parent=11703"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/categories?post=11703"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ieice.org\/cs\/ap\/wp-json\/wp\/v2\/tags?post=11703"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}