General Information

  • Conference: 2017 Thailand-Japan MicroWave (TJMW2017)
  • Period: June 14-16, 2017
  • Venue: KMUTT Knowledge Exchange for Innovation Center (KX), King Mongkut's University of Technology Thonburi (KMUTT), Bangkok, Thailand
  • Online publication date: June 14, 2017

About 2017 Thailand-Japan MicroWave (TJMW2017)

The TJMW is the annual international technical meeting between Thailand and Japan for researchers involved in all aspects of microwave theory and practice. TJMW2017 is sponsored by IEICE Technical Committee on Microwaves and is jointly hosted by King Mongkut's University of Technology Thonburi (KMUTT). Technical co-sponsorships are acknowledged by

  • iEMAT
  • IEICE Bangkok Section
  • IEEE MTT/AP/ED Thailand Chapters
  • ECTI Association
  • IEEE MTT-S Japan/Kansai/Nagoya Chapters
  • IEICE Technical Committee on Integrated Circuits and Devices
  • IEICE Technical Committee on Wireless Power Transfer
The TJMW2017 is supported by
  • Thaicom Public Company Limited
  • Stang Company Limited
  • UM-Services, LTD.
  • National Instruments, AWR Group
  • M-RF Co., Ltd.
  • DEVICE CO., LTD
  • Anritsu Corporation
  • Keysight Technologies

Conference Topics

The topic includes but is not limited to:

A. Active Devices and Circuits:

    Low-noise devices and circuits, high-power devices and circuits, control circuits (mixers, oscillators, switches, etc.), MMICs and HMICs (receivers, transmitters, etc.), silicon RF devices

B. Passive Components:

    Filters and resonators, ferrite and surface wave components, packaging techniques, passive devices and circuits, waveguides, transmission lines

C. Systems:

    Communication systems, microwave applications (ITS, SPS, etc.), microwave medical & biological applications/EMC/EMI, phased array antenna systems

D. Fundamental theory and techniques:

    Scattering and propagation, electromagnetic field theory and CAD, antenna theory and designs, microwave photonics, microwave superconductivity, measurement techniques

E. Emerging Technologies:

    RF MEMS, active antennas, photonic bandgap and artificial metamaterials, software defined radio, wireless LAN/Bluetooth and wireless power transfer