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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]		 2015-12-03
10:50		 Nagasaki Nagasaki Kinro Fukushi Kaikan [Invited Talk] Development of Via Structures in IC Package Substrates for Impedance Reduction
Tomoyuki Akaboshi, Taiga Fukumori, Daisuke Mizutani, Motoaki Tani (Fujitsu Lab.) CPM2015-136 ICD2015-61		 This paper describes the impedance reduction technologies in build-up package substrates for high performance CPU, such ... [more] CPM2015-136 ICD2015-61
pp.51-54
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