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Committee Date Time Place Paper Title / Authors Abstract Paper #
R 2011-11-18
14:10		 Osaka   Temperature Humidity Test of Silver-Epoxy Isotropic Conductive Adhesive
Takuya Hirata, Yuichi Aoki (ESPEC CORP.) R2011-35		 To evaluate the reliability test condition for Isotropic Conductive Adhesive (ICA), we curried out various temperature h... [more] R2011-35
pp.13-17
MW, ED 2005-11-17
14:00		 Saga   A High Humidity Resistance and High Power Density TaN/Au T-gate pHEMT for Ka-band Applications
Hirotaka Amasuga, Seiki Goto, Toshihiko Shiga, Masahiro Totsuka, Hajime Sasaki, Tetsuo Kunii, Yoshitsugu Yamamoto, Akira Inoue, Tomoki Oku, Takahide Ishikawa (Mitsubishi Electric Corp.) 		A 0.8 W/mm high power pHEMT with high resistance to humidity is reported. By using tantalum nitride as the refractory ga... [more] ED2005-166 MW2005-121
pp.45-49
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