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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| LQE | 2018-07-12 14:20 |
Hokkaido | Hybrid-Integration Technologies of InP-SOA on Silicon Optical Platform Takeshi Matsumoto, Teruo Kurahashi (Fujitsu Lab), Ryotaro Konoike, Keijiro Suzuki, Ken Tanizawa (AIST), Ayahito Uetake, Kazumasa Takabayashi (Fujitsu Lab), Kazuhiro Ikeda, Hitoshi Kawashima (AIST), Suguru Akiyama, Shigeaki Sekiguchi (Fujitsu Lab)  LQE2018-23 |
We investigated hybrid-integration technologies of semiconductor optical amplifiers (SOAs) on Si optical platforms for o... [more] | LQE2018-23 pp.13-16 |
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| ICD, CPSY, CAS | 2017-12-14 15:10 |
Okinawa | Art Hotel Ishigakijima | Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter Yuki Karasawa, Yusuke Gotou, Shintaro Hara, Takanobu Fukuoka, Kousuke Miyaji (Shinshu Univ.) CAS2017-92 ICD2017-80 CPSY2017-89 |
This work compares high frequency hysteretic buck converters implemented by chip-on-board wire bonding and flip-chip bon... [more] | CAS2017-92 ICD2017-80 CPSY2017-89 p.129 |
| EMD, LQE, OPE, CPM, R | 2014-08-22 14:25 |
Hokkaido | Otaru Economy Center | Opto-electronic hybrid integrated chip packaging technology for silicon photonic platform using gold-stud bump bonding Mitsuo Usui, Kotaro Takeda, Hirooki Hirata, Hiroshi Fukuda, Tai Tsuchizawa, Hidetaka Nishi, Rai Kou, Tatsuro Hiraki, Kentaro Honda, Masafumi Nogawa, Koji Yamada, Tsuyoshi Yamamoto (NTT) R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49 |
We propose a new solder-free and low-temperature (200 ℃ or less) flip-chip integration technology for silicon photonic p... [more] | R2014-45 EMD2014-50 CPM2014-65 OPE2014-75 LQE2014-49 pp.109-114 |
| LQE, OPE | 2013-06-21 16:40 |
Tokyo | Four-wavelength hybrid laser array for silicon CWDM transmitter Shinsuke Tanaka, Seok-Hwan Jeong, Tomoyuki Akiyama, Shigeaki Sekiguchi, Teruo Kurahashi, Yu Tanaka, Ken Morito (PETRA/Fujitsu Labs.) OPE2013-16 LQE2013-26 |
A compact, large-scale integrated Si optical I/O chip is a very promising candidate for an optical interconnections used... [more] | OPE2013-16 LQE2013-26 pp.49-53 |
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| CPM, ICD | 2008-01-18 15:45 |
Tokyo | Kikai-Shinko-Kaikan Bldg | A method of Ultra-fine Pad Interconnection using Electroless Deposition Tokihiko Yokoshima, Yasuhiro Yamaji, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) CPM2007-147 ICD2007-158 |
Decrease in bonding temperature and bonding pressure are key challenges for higher interconnection-density packages in r... [more] | CPM2007-147 ICD2007-158 pp.111-116 |
| MW | 2006-06-27 11:20 |
Aichi | 60GHz Subharmonic Mixer Module Using Stud Bump Bonding Technology Kohei Masuda, Futoshi Takeuchi (Tohoku Univ.), Yasuhiro Hamada, Kenichi Maruhashi (NEC), Hiroshi Oguma, Suguru Kameda, Hiroyuki Nakase, Tadashi Takagi, Kazuo Tsubouchi (Tohoku Univ.) |
60-GHz band is expected to be used for wireless personal area network with a data rate of more than 3Gbit/s. We are aim... [more] | MW2006-27 pp.11-16 |
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| ED, MW | 2006-01-18 13:30 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | A Low-Phase-Noise 76-GHz Planar Gunn VCO Using Flip-Chip Bonding Technology Takashi Yoshida, Yoshimichi Fukasawa, Tadayoshi Deguchi, Kiyoshi Kawaguchi, Takahiro Sugiyama, Atsushi Nakagawa (New Japan Radio) |
A low-phase-noise76-GHz planar Gunn VCO using flip-chip bonding technology has been developed. The power consumption is ... [more] | ED2005-192 MW2005-146 pp.1-5 |
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