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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
MW, WPT |
2018-04-27 14:50 |
Tokyo |
Kikai-Shinko-Kaikan Building |
S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate Kengo Kawasaki, Eigo Kuwata, Hidenori Ishibashi, Tomohiro Yao, Kiyoshi Ishida, Kazuhiro Maeda, Hironobu Shibata, Masaomi Tsuru, Kazutomi Mori, Mitsuhiro Shimozawa, Hiroshi Fukumoto (Mitsubishi Electric Corp.) WPT2018-5 MW2018-5 |
A SiGe chip and GaN chip packaged Tx module in S-band is represented. SiGe and GaN with Redistribution Layer (RDL) are i... [more] |
WPT2018-5 MW2018-5 pp.19-23 |
MW |
2017-06-22 14:25 |
Aichi |
A-101, Wing-A, Toyohashi University of Technology |
2.4GHz band SOI-CMOS bridge rectifier IC Seishu Yanagihara, Shunya Tsuchimoto, Kenji Itoh (KIT), Kengo Kawasaki, Tomohiro Yao, Masaomi Tsuru (Mitsubishi Electric Corp.) MW2017-22 |
[more] |
MW2017-22 pp.5-8 |
MW |
2013-12-20 13:55 |
Saitama |
Saitama Univ. |
Frequency Characteristic of Power Efficiency for 2 GaN Band GaN HEMT Amplifier with Harmonic Reactive Termination Tomohiro Yao, Ryo Ishikawa, Kazuhiko Honjo (UEC) MW2013-172 |
For microwave power amplifiers, if higher-order harmonics are treated to increase efficiency by using any distributed tr... [more] |
MW2013-172 pp.115-120 |
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