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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2019-02-07 11:25 |
Tokyo |
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[Invited Talk]
Ultrafine 3D Interconnect Technology Using Directed Self-Assembly Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2018-92 |
A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-h... [more] |
SDM2018-92 pp.5-8 |
SDM |
2016-01-22 15:25 |
Tokyo |
Sanjo Conference Hall, The University of Tokyo |
[Invited Talk]
Novel reconfigured wafer-to-wafer(W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration Kangwook Lee, Taksfumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2015-117 |
[more] |
SDM2015-117 pp.39-43 |
SDM |
2014-02-28 15:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Talk]
TSV Liner Formation with Vapor Deposited Polyimides Takafumi Fukushima, Mariappan Murugesan, Jicheol Bea, Kangwook Lee, Mitsumasa Koyanagi (Tohoku Univ.) SDM2013-172 |
A Kapton insulation layer as a TSV liner was conformably formed by vapor deposition polymerization with pyromellitic dia... [more] |
SDM2013-172 pp.39-42 |
SDM |
2013-02-04 10:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
CuSn/InAu microbump induced local deformation and mechanical stress in high-density 3D-LSI Murugesan Murugesan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2012-151 |
[more] |
SDM2012-151 pp.5-8 |
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2012-11-27 10:45 |
Fukuoka |
Centennial Hall Kyushu University School of Medicine |
[Invited Talk]
Overview of 3D Integration Technology and Challenges for Volume Production Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) CPM2012-115 ICD2012-79 |
[more] |
CPM2012-115 ICD2012-79 pp.15-22 |
SDM |
2011-02-07 14:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Stress Mapping in Thinned Si Wafer with Cu-TSV and Cu-Sn Microbumps Murugesan Mariappan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2010-223 |
[more] |
SDM2010-223 pp.43-47 |
SDM |
2010-02-05 10:05 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Keynote Address]
Key Issues and Future Prospects for 3-D Integration Technology Mitsumasa Koyanagi, Takafumi Fukushima, Kangwook Lee, Tetsu Tanaka (Tohoku Univ.) SDM2009-182 |
[more] |
SDM2009-182 pp.1-6 |
ICD, SDM |
2008-07-17 13:10 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
[Invited Talk]
Super Chip Technology to Achieve Ultimate Integration Mitsumasa Koyanagi, Tetsu Tanaka (Tohoku Univ.) SDM2008-134 ICD2008-44 |
[more] |
SDM2008-134 ICD2008-44 pp.35-40 |
SDM |
2008-06-10 14:10 |
Tokyo |
An401・402, Inst. Indus. Sci., The Univ. of Tokyo |
Characterization of Metal Nanodots Nonvolatile Memory Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2008-56 |
[more] |
SDM2008-56 pp.83-88 |
NC |
2007-10-19 10:50 |
Miyagi |
Tohoku University |
Development of Si Double-sided Microelectrodes with Vertical Interconnction Risato Kobayashi, Takafumi Fukushima, Kazuhiro Sakamoto, Tetsu Tanaka, Norihiro Katayama, Hajime Mushiake, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] |
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ICD, CPM |
2007-01-18 15:20 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
[Special Invited Talk]
3-Dimensional Packaging Technology and Super-Chip Integration Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] |
CPM2006-139 ICD2006-181 pp.61-65 |
ICD, SIP, IE, IPSJ-SLDM |
2006-10-27 11:30 |
Miyagi |
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Reconfigurable Stacked Memory System for Parallel Image Processing Using Three-Dimensional LSI Technology Daijiro Amano, Takeaki Sugimura, Yuta Konishi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) |
The real-time image processing system with a frame rate beyond video rate is required for the high-speed visual informat... [more] |
SIP2006-108 ICD2006-134 IE2006-86 pp.43-48 |
ICD, SIP, IE, IPSJ-SLDM |
2006-10-27 11:50 |
Miyagi |
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Design of parallel A/D Converter with Variation Correction for Parallel Image Processing system using Three-Dimensional Integration Technology Yuta Konishi, Takeaki Sugimura, Daijirou Amano, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] |
SIP2006-109 ICD2006-135 IE2006-87 pp.49-54 |
RECONF |
2006-05-18 13:00 |
Miyagi |
TOHOKU UNIVERSITY |
[Special Invited Talk]
Three-Dimensional Integration Technology and Reconfigurable 3D-SoC Mitsumasa Koyanagi, Takeaki Sugimura, Takafumi Fukushima, Tetsu Tanaka (Tohoku Univ.) |
[more] |
RECONF2006-3 pp.13-18 |
RECONF |
2005-05-13 17:15 |
Kyoto |
Kyoto University |
Robot Vision System with Three Dimensionally Integrated Reconfigurable Image Processor Takeaki Sugimura, Jun Deguchi, Yuta Konishi, Yoshihiro Nakatani, Takafumi Fukushima, Atsushi Konno, Hiroyuki Kurino, Masaru Uchiyama, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] |
RECONF2005-28 pp.79-84 |
ICD |
2004-12-16 16:15 |
Hiroshima |
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Robot Vision System with Parallel Reconfigurable Image Processor Takeaki Sugimura, Jun Deguchi, Yuta Konishi, Yoshihiro Nakatani, Takafumi Fukushima, Atsushi Konno, Hiroyuki Kurino, Masaru Uchiyama, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] |
ICD2004-191 pp.49-54 |
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