Paper Abstract and Keywords |
Presentation |
2017-12-14 15:10
Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter Yuki Karasawa, Yusuke Gotou, Shintaro Hara, Takanobu Fukuoka, Kousuke Miyaji (Shinshu Univ.) CAS2017-92 ICD2017-80 CPSY2017-89 Link to ES Tech. Rep. Archives: ICD2017-80 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
This work compares high frequency hysteretic buck converters implemented by chip-on-board wire bonding and flip-chip bonding in terms of efficiency, switching frequency and operation stability. The converters have been implemented in a standard 0.35 {mu}m CMOS process using 5 V IO transistors. 5 ~ 30 MHz operation is demonstrated with 88.5 % efficiency at 2.8 W output in the flip-chip bonding sample and 87.1 % at 2.7 W in the wire bonding sample. However, unstable oscillation and non-periodic spikes of output voltage are observed in the wire bonding sample. The simulations show that the noise induced by the bonding wire impedance is injected to the input of the hysteretic comparator causing the unstable oscillation. The flip-chip bonding sample shows 1.0 ~ 1.5 % higher efficiency and stable oscillation compared with the wire bonding sample. Flip-chip bonding is essential for efficient and stable high frequency DC-DC converter operation. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
wire bonding / flip-chip bonding / DC-DC converter / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 117, no. 344, ICD2017-80, pp. 129-129, Dec. 2017. |
Paper # |
ICD2017-80 |
Date of Issue |
2017-12-07 (CAS, ICD, CPSY) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
CAS2017-92 ICD2017-80 CPSY2017-89 Link to ES Tech. Rep. Archives: ICD2017-80 |
Conference Information |
Committee |
ICD CPSY CAS |
Conference Date |
2017-12-14 - 2017-12-15 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Art Hotel Ishigakijima |
Topics (in Japanese) |
(See Japanese page) |
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Paper Information |
Registration To |
ICD |
Conference Code |
2017-12-ICD-CPSY-CAS |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter |
Sub Title (in English) |
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Keyword(1) |
wire bonding |
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flip-chip bonding |
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DC-DC converter |
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1st Author's Name |
Yuki Karasawa |
1st Author's Affiliation |
Shinshu University (Shinshu Univ.) |
2nd Author's Name |
Yusuke Gotou |
2nd Author's Affiliation |
Shinshu University (Shinshu Univ.) |
3rd Author's Name |
Shintaro Hara |
3rd Author's Affiliation |
Shinshu University (Shinshu Univ.) |
4th Author's Name |
Takanobu Fukuoka |
4th Author's Affiliation |
Shinshu University (Shinshu Univ.) |
5th Author's Name |
Kousuke Miyaji |
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Shinshu University (Shinshu Univ.) |
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Speaker |
Author-1 |
Date Time |
2017-12-14 15:10:00 |
Presentation Time |
120 minutes |
Registration for |
ICD |
Paper # |
CAS2017-92, ICD2017-80, CPSY2017-89 |
Volume (vol) |
vol.117 |
Number (no) |
no.343(CAS), no.344(ICD), no.345(CPSY) |
Page |
p.129 |
#Pages |
1 |
Date of Issue |
2017-12-07 (CAS, ICD, CPSY) |
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