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Presentation 2017-12-14 15:10
Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter
Yuki Karasawa, Yusuke Gotou, Shintaro Hara, Takanobu Fukuoka, Kousuke Miyaji (Shinshu Univ.) CAS2017-92 ICD2017-80 CPSY2017-89 Link to ES Tech. Rep. Archives: ICD2017-80
Abstract (in Japanese) (See Japanese page) 
(in English) This work compares high frequency hysteretic buck converters implemented by chip-on-board wire bonding and flip-chip bonding in terms of efficiency, switching frequency and operation stability. The converters have been implemented in a standard 0.35 {mu}m CMOS process using 5 V IO transistors. 5 ~ 30 MHz operation is demonstrated with 88.5 % efficiency at 2.8 W output in the flip-chip bonding sample and 87.1 % at 2.7 W in the wire bonding sample. However, unstable oscillation and non-periodic spikes of output voltage are observed in the wire bonding sample. The simulations show that the noise induced by the bonding wire impedance is injected to the input of the hysteretic comparator causing the unstable oscillation. The flip-chip bonding sample shows 1.0 ~ 1.5 % higher efficiency and stable oscillation compared with the wire bonding sample. Flip-chip bonding is essential for efficient and stable high frequency DC-DC converter operation.
Keyword (in Japanese) (See Japanese page) 
(in English) wire bonding / flip-chip bonding / DC-DC converter / / / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 344, ICD2017-80, pp. 129-129, Dec. 2017.
Paper # ICD2017-80 
Date of Issue 2017-12-07 (CAS, ICD, CPSY) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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Conference Information
Committee ICD CPSY CAS  
Conference Date 2017-12-14 - 2017-12-15 
Place (in Japanese) (See Japanese page) 
Place (in English) Art Hotel Ishigakijima 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To ICD 
Conference Code 2017-12-ICD-CPSY-CAS 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Comparisons of Wire Bonding and Flip-Chip Bonding in High Frequency Hysteretic DC-DC Buck Converter 
Sub Title (in English)  
Keyword(1) wire bonding  
Keyword(2) flip-chip bonding  
Keyword(3) DC-DC converter  
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1st Author's Name Yuki Karasawa  
1st Author's Affiliation Shinshu University (Shinshu Univ.)
2nd Author's Name Yusuke Gotou  
2nd Author's Affiliation Shinshu University (Shinshu Univ.)
3rd Author's Name Shintaro Hara  
3rd Author's Affiliation Shinshu University (Shinshu Univ.)
4th Author's Name Takanobu Fukuoka  
4th Author's Affiliation Shinshu University (Shinshu Univ.)
5th Author's Name Kousuke Miyaji  
5th Author's Affiliation Shinshu University (Shinshu Univ.)
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Date Time 2017-12-14 15:10:00 
Presentation Time 120 minutes 
Registration for ICD 
Paper # CAS2017-92, ICD2017-80, CPSY2017-89 
Volume (vol) vol.117 
Number (no) no.343(CAS), no.344(ICD), no.345(CPSY) 
Page p.129 
#Pages
Date of Issue 2017-12-07 (CAS, ICD, CPSY) 


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