Paper Abstract and Keywords |
Presentation |
2017-10-19 13:55
Study of Via Hole on MMIC using Nickel Layer Takahiro Tsushima, Masayuki Kimishima (AT Lab.) EMCJ2017-33 MW2017-85 EST2017-48 Link to ES Tech. Rep. Archives: MW2017-85 EST2017-48 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
In MMIC (Microwave Monolithic Integrated Circuit) and PCB (Printed Circuit Board), nickel plating is widely used. However, since nickel is a ferromagnetic material, there is concern about the magnetic influence on circuit components. In PCB, it is reported that conductor loss increases due to the influence of nickel plating as a base of gold plating. In this paper, we confirmed that how the nickel layer affects the characteristics of via holes on MMIC using electromagnetic simulation. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Electromagnetic Simulation / Nickel / MMIC / / / / / |
Reference Info. |
IEICE Tech. Rep., vol. 117, no. 245, EST2017-48, pp. 41-44, Oct. 2017. |
Paper # |
EST2017-48 |
Date of Issue |
2017-10-12 (EMCJ, MW, EST) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EMCJ2017-33 MW2017-85 EST2017-48 Link to ES Tech. Rep. Archives: MW2017-85 EST2017-48 |
Conference Information |
Committee |
MW EMCJ EST |
Conference Date |
2017-10-19 - 2017-10-20 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Yupopo |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
Electromagnetic simulation ,EMC, Microwave technologies |
Paper Information |
Registration To |
EST |
Conference Code |
2017-10-MW-EMCJ-EST-EMC |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Study of Via Hole on MMIC using Nickel Layer |
Sub Title (in English) |
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Keyword(1) |
Electromagnetic Simulation |
Keyword(2) |
Nickel |
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MMIC |
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1st Author's Name |
Takahiro Tsushima |
1st Author's Affiliation |
Advantest Laboratories Ltd. (AT Lab.) |
2nd Author's Name |
Masayuki Kimishima |
2nd Author's Affiliation |
Advantest Laboratories Ltd. (AT Lab.) |
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Speaker |
Author-1 |
Date Time |
2017-10-19 13:55:00 |
Presentation Time |
20 minutes |
Registration for |
EST |
Paper # |
EMCJ2017-33, MW2017-85, EST2017-48 |
Volume (vol) |
vol.117 |
Number (no) |
no.243(EMCJ), no.244(MW), no.245(EST) |
Page |
pp.41-44 |
#Pages |
4 |
Date of Issue |
2017-10-12 (EMCJ, MW, EST) |
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