IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
... (for ESS/CS/ES/ISS)
Tech. Rep. Archives
... (for ES/CS)
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2017-10-19 13:55
Study of Via Hole on MMIC using Nickel Layer
Takahiro Tsushima, Masayuki Kimishima (AT Lab.)
Abstract (in Japanese) (See Japanese page) 
(in English) In MMIC (Microwave Monolithic Integrated Circuit) and PCB (Printed Circuit Board), nickel plating is widely used. However, since nickel is a ferromagnetic material, there is concern about the magnetic influence on circuit components. In PCB, it is reported that conductor loss increases due to the influence of nickel plating as a base of gold plating. In this paper, we confirmed that how the nickel layer affects the characteristics of via holes on MMIC using electromagnetic simulation.
Keyword (in Japanese) (See Japanese page) 
(in English) Electromagnetic Simulation / Nickel / MMIC / / / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 245, EST2017-48, pp. 41-44, Oct. 2017.
Paper # EST2017-48 
Date of Issue 2017-10-12 (EMCJ, MW, EST) 
ISSN Print edition: ISSN 0913-5685  Online edition: ISSN 2432-6380

Conference Information
Committee MW EMCJ EST  
Conference Date 2017-10-19 - 2017-10-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Yupopo 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Electromagnetic simulation ,EMC, Microwave technologies 
Paper Information
Registration To EST 
Conference Code 2017-10-MW-EMCJ-EST-EMC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Study of Via Hole on MMIC using Nickel Layer 
Sub Title (in English)  
Keyword(1) Electromagnetic Simulation  
Keyword(2) Nickel  
Keyword(3) MMIC  
1st Author's Name Takahiro Tsushima  
1st Author's Affiliation Advantest Laboratories Ltd. (AT Lab.)
2nd Author's Name Masayuki Kimishima  
2nd Author's Affiliation Advantest Laboratories Ltd. (AT Lab.)
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Date Time 2017-10-19 13:55:00 
Presentation Time 20 
Registration for EST 
Paper # IEICE-EMCJ2017-33,IEICE-MW2017-85,IEICE-EST2017-48 
Volume (vol) IEICE-117 
Number (no) no.243(EMCJ), no.244(MW), no.245(EST) 
Page pp.41-44 
#Pages IEICE-4 
Date of Issue IEICE-EMCJ-2017-10-12,IEICE-MW-2017-10-12,IEICE-EST-2017-10-12 

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan