講演抄録/キーワード |
講演名 |
2012-08-27 14:30
The influence of bonding layer on the characteristic of piezoelectric polymer transducer ○Yonggang Cao・Kang-Lyeol Ha・Moojoon Kim(Pukyong National Univ.)・Jungsoon Kim(Tongmyong Univ.) US2012-40 |
抄録 |
(和) |
Piezoelectric polymer film poly(vinylidene fluoride) (PVDF) is increasingly used to make the high-frequency ultrasound transducer. This film is usually bonded with backing substrate by an adhesive material, such as epoxy, for the transducers. The adhesive layer, called bonding layer in this paper, influences the electromechanical characteristics of the transducer. In this study, the effects of the bonding layer on the characteristics of piezoelectric polymer transducer were investigated intensively. EPO-TEK 301 epoxy was used to bond a PVDF film (52 μm thickness) with backing substrate of copper(Cu) together. The resonance characteristics of the films themselves and of the transducers made of the films with different active area were measured by an impedance analyzer, and the pulse-echo responses of the transducers with different thickness of the bonding layer were measured by a pulsar/receiver system. The measured results were compared with those of simulation by KLM equivalent circuit model. As the results, it was shown that the bonding layer changes the waveform of pulse-echo response dramatically and reduces the resonance frequency of the transducer. Consequently, it was noted that the influence of bonding layer should be carefully considered in polymer transducer design. |
(英) |
Piezoelectric polymer film poly(vinylidene fluoride) (PVDF) is increasingly used to make the high-frequency ultrasound transducer. This film is usually bonded with backing substrate by an adhesive material, such as epoxy, for the transducers. The adhesive layer, called bonding layer in this paper, influences the electromechanical characteristics of the transducer. In this study, the effects of the bonding layer on the characteristics of piezoelectric polymer transducer were investigated intensively. EPO-TEK 301 epoxy was used to bond a PVDF film (52 μm thickness) with backing substrate of copper(Cu) together. The resonance characteristics of the films themselves and of the transducers made of the films with different active area were measured by an impedance analyzer, and the pulse-echo responses of the transducers with different thickness of the bonding layer were measured by a pulsar/receiver system. The measured results were compared with those of simulation by KLM equivalent circuit model. As the results, it was shown that the bonding layer changes the waveform of pulse-echo response dramatically and reduces the resonance frequency of the transducer. Consequently, it was noted that the influence of bonding layer should be carefully considered in polymer transducer design. |
キーワード |
(和) |
Ultrasound transducer / PVDF / Bonding layer / KLM model / / / / |
(英) |
Ultrasound transducer / PVDF / Bonding layer / KLM model / / / / |
文献情報 |
信学技報, vol. 112, no. 186, US2012-40, pp. 33-36, 2012年8月. |
資料番号 |
US2012-40 |
発行日 |
2012-08-20 (US) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
著作権に ついて |
技術研究報告に掲載された論文の著作権は電子情報通信学会に帰属します.(許諾番号:10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
PDFダウンロード |
US2012-40 |
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