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Paper Abstract and Keywords
Presentation 2012-04-27 17:10
Bottom Gate TFT using Low Temperature Deposited Nanocrystalline-Si
Asuka Syuku, Eiji Takahashi, Yasunori Andoh (Nissin Electric)
Abstract (in Japanese) (See Japanese page) 
(in English) Thin film transistors (TFTs) with nanocrystalline silicon (nc-Si) films which were directly deposited on substrate at 150¡î were fabricated by using ICP (Inductively Coupled Plasma) CVD method. The NH3 plasma treatment after nc-Si deposition increased TFT mobility up to 0.48cm2/Vs. The threshold voltage shift (¦¤Vth) after gate bias stress of 10000sec at +20V was 1.94V. Furthermore, nc-Si TFT deposited using SiF4 gas aimed for terminating film defects by Fluorine atoms showed good transfer characteristics.
Keyword (in Japanese) (See Japanese page) 
(in English) nc-Si / TFT / ICPCVD / / / / /  
Reference Info. IEICE Tech. Rep., vol. 112, no. 18, SDM2012-10, pp. 45-48, April 2012.
Paper # SDM2012-10, OME2012-10 
Date of Issue 2012-04-20 (SDM, OME) 

Conference Information
Committee SDM OME  
Conference Date 2012-04-27 - 2012-04-28 
Place (in Japanese) (See Japanese page) 
Place (in English) Okinawa-Ken-Seinen-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Advanced Thin-Film Devices (Si, Compound, Organic) and Related Topics 
Paper Information
Registration To SDM 
Conference Code 2012-04-SDM-OME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Bottom Gate TFT using Low Temperature Deposited Nanocrystalline-Si 
Sub Title (in English)  
Keyword(1) nc-Si 
Keyword(2) TFT 
Keyword(3) ICPCVD 
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1st Author's Name Asuka Syuku  
1st Author's Affiliation Nissin Electric Co.,Ltd. (Nissin Electric)
2nd Author's Name Eiji Takahashi  
2nd Author's Affiliation Nissin Electric Co.,Ltd. (Nissin Electric)
3rd Author's Name Yasunori Andoh  
3rd Author's Affiliation Nissin Electric Co.,Ltd. (Nissin Electric)
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Speaker
Date Time 2012-04-27 17:10:00 
Presentation Time 20 
Registration for SDM 
Paper # IEICE-SDM2012-10,IEICE-OME2012-10 
Volume (vol) IEICE-112 
Number (no) no.18(SDM), no.19(OME) 
Page pp.45-48 
#Pages IEICE-4 
Date of Issue IEICE-SDM-2012-04-20,IEICE-OME-2012-04-20 


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