Paper Abstract and Keywords |
Presentation |
2005-11-17 14:00
A High Humidity Resistance and High Power Density TaN/Au T-gate pHEMT for Ka-band Applications Hirotaka Amasuga, Seiki Goto, Toshihiko Shiga, Masahiro Totsuka, Hajime Sasaki, Tetsuo Kunii, Yoshitsugu Yamamoto, Akira Inoue, Tomoki Oku, Takahide Ishikawa (Mitsubishi Electric Corp.) Link to ES Tech. Rep. Archives: ED2005-166 MW2005-121 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
A 0.8 W/mm high power pHEMT with high resistance to humidity is reported. By using tantalum nitride as the refractory gate metal and a silicon nitride layer prepared by a catalytic chemical vapor deposition technique for passivation of this transistor, tough moisture resistance was obtained showing no Id degradation even after 1000 hours at 130 degrees centigrade and 85% humidity. Moreover, the Schottky breakdown voltage of the TaN gate is higher than that of a WSiN gate. A one-stage prematched amplifier with the new pHEMT has achieved 0.8 W/mm output power at Vd = 8 V, with 8.5 dB gain and 40% power added efficiency in the Ka-band. These are some of the highest power figures ever reported. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Ka-band / HEMT / humidity resistance / tantalum nitride / catalytic chemical vapor deposition / / / |
Reference Info. |
IEICE Tech. Rep., vol. 105, no. 400, ED2005-166, pp. 45-49, Nov. 2005. |
Paper # |
ED2005-166 |
Date of Issue |
2005-11-10 (ED, MW) |
ISSN |
Print edition: ISSN 0913-5685 |
Copyright and reproduction |
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Link to ES Tech. Rep. Archives: ED2005-166 MW2005-121 |
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