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Presentation 2005-11-17 14:00
A High Humidity Resistance and High Power Density TaN/Au T-gate pHEMT for Ka-band Applications
Hirotaka Amasuga, Seiki Goto, Toshihiko Shiga, Masahiro Totsuka, Hajime Sasaki, Tetsuo Kunii, Yoshitsugu Yamamoto, Akira Inoue, Tomoki Oku, Takahide Ishikawa (Mitsubishi Electric Corp.) Link to ES Tech. Rep. Archives: ED2005-166 MW2005-121
Abstract (in Japanese) (See Japanese page) 
(in English) A 0.8 W/mm high power pHEMT with high resistance to humidity is reported. By using tantalum nitride as the refractory gate metal and a silicon nitride layer prepared by a catalytic chemical vapor deposition technique for passivation of this transistor, tough moisture resistance was obtained showing no Id degradation even after 1000 hours at 130 degrees centigrade and 85% humidity. Moreover, the Schottky breakdown voltage of the TaN gate is higher than that of a WSiN gate. A one-stage prematched amplifier with the new pHEMT has achieved 0.8 W/mm output power at Vd = 8 V, with 8.5 dB gain and 40% power added efficiency in the Ka-band. These are some of the highest power figures ever reported.
Keyword (in Japanese) (See Japanese page) 
(in English) Ka-band / HEMT / humidity resistance / tantalum nitride / catalytic chemical vapor deposition / / /  
Reference Info. IEICE Tech. Rep., vol. 105, no. 400, ED2005-166, pp. 45-49, Nov. 2005.
Paper # ED2005-166 
Date of Issue 2005-11-10 (ED, MW) 
ISSN Print edition: ISSN 0913-5685
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF Link to ES Tech. Rep. Archives: ED2005-166 MW2005-121

Conference Information
Committee MW ED  
Conference Date 2005-11-17 - 2005-11-17 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To ED 
Conference Code 2005-11-MW-ED 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A High Humidity Resistance and High Power Density TaN/Au T-gate pHEMT for Ka-band Applications 
Sub Title (in English)  
Keyword(1) Ka-band  
Keyword(2) HEMT  
Keyword(3) humidity resistance  
Keyword(4) tantalum nitride  
Keyword(5) catalytic chemical vapor deposition  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hirotaka Amasuga  
1st Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
2nd Author's Name Seiki Goto  
2nd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
3rd Author's Name Toshihiko Shiga  
3rd Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
4th Author's Name Masahiro Totsuka  
4th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
5th Author's Name Hajime Sasaki  
5th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
6th Author's Name Tetsuo Kunii  
6th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
7th Author's Name Yoshitsugu Yamamoto  
7th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
8th Author's Name Akira Inoue  
8th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
9th Author's Name Tomoki Oku  
9th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
10th Author's Name Takahide Ishikawa  
10th Author's Affiliation Mitsubishi Electric Corporation (Mitsubishi Electric Corp.)
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Speaker Author-1 
Date Time 2005-11-17 14:00:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2005-166, MW2005-121 
Volume (vol) vol.105 
Number (no) no.400(ED), no.401(MW) 
Page pp.45-49 
#Pages
Date of Issue 2005-11-10 (ED, MW) 


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