Special Issue on Recent Electromechanical Devices
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 . FOREWORD ....................................................... 1535
        Koichiro SAWA

INVITED PAPERS
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 . Technical Trends on Electromechanical Devices .................. 1536
        Takeshi AOKI and Yasuhisa NISHIMURA

 . Recent Development of Testing System for Arcing Contacts ....... 1545
        Hideaki SONE and Tasuku TAKAGI

PAPERS
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[Connectors: Optical and Conventional]

 . Self-Holding Optical Switch Using Optical Matrix Board ......... 1553
        Shuichiro INAGAKI, Yoriko HANAOKA and Tsuneo KANAI

 . Characteristics and Static Fatigue Reliability of a Zirconia
   Alignment Sleeve for Optical Connectors ........................ 1559
        Kazunori KANAYAMA, Yasuhiro ANDO, Shin'ichi IWANO and Ryo
        NAGASE

 . High-Density, High-Bandwidth Connectors for Broad-Band ISDN .... 1567
        Ken-ichi NAKANO, Kei-ichi YASUDA and Tohru KISHIMOTO

 . Coaxial SMD Module Connector for High-Speed MCM ................ 1575
        Shinichi SASAKI, Tohru KISHIMOTO and Nobuaki SUGIURA

[Actuator and Resonator]

 . Optical Head Lens Actuator for High Information Bit Rate Recording
            ....................................................... 1581
        Tsutomu MATSUI

 . Analysis of Nonohmic Piezoelectric Resonator Contacts .......... 1587
        Noboru WAKATSUKI, Masaaki ONO, Kenji FUKAYAMA and Masanori
        YACHI

[Simulation and AI-Technology]

 . Contact Resistance between Plated Conductors and Current Density
   Distribution in a Contact Spot ................................. 1592
        Isao MINOWA and Mitsunobu NAKAMURA

 . Constriction Resistance of Two Conducting Spots ................ 1597
        Hitoshi NISHIYAMA, Mitsunobu NAKAMURA and Isao MINOWA

 . Modeling Contact Erosion Using Object-Oriented Technology ...... 1606
        Kunio OHNO

[Contact Reliability]

 . Significant Decrease in Thickness of Contaminant Films and Contact
   Resistance by Humidification ................................... 1614
        Terutaka TAMAI and Tetsushi KAWANO

 . Analysis of Bonding State in Clad Contact Using Ultrasonic
   Microscope ..................................................... 1621
        Takeshi SUZUKI and Masayuki NODA

 . A Study of the Relationship between Contact Materials and Sticking
   Characteristics on Telecommunication Relay ..................... 1627
        Hideki IWATA, Toshio OHYA, Shoji MITSUISHI and Hiroki MARUYAMA

[Arcing Discharge and Contact Characteristics]

 . A System of Measuring the Spatial Distribution of Spectroscopic
   Intensity in a Cross Section of Arc Column ..................... 1634
        Mitsuru TAKEUCHI and Takayoshi KUBONO

 . Simultaneous Measurements of Two Wavelength Spectra for Ag Break Arc
            ....................................................... 1640
        Kiyoshi YOSHIDA and Atsuo TAKAHASHI

 . The Influence of Oxygen Concentration on Contact Resistance
   Behaviours of Ag and Pd Materials in DC Breaking Arcs .......... 1647
        Zhuan-Ke CHEN, Keisuke ARAI and Koichiro SAWA

 . An Experimental Study on Material Transfer and Arc Erosion
   Characteristic of Ag Contacts under Switching Lower Current .... 1655
        Hiroaki MIZUKOSHI, Koichiro SAWA, Makoto HASEGAWA and Kae
        NIIZUMA

[Sliding Contacts]

 . Contact Characteristics of New Self-Lubricating Composite Materials
            ....................................................... 1662
        Yoshitada WATANABE

Regular Section
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PAPERS
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[Integrated Electronics]

 . Methodology for Latchup-Free Design in Merged BiPMOSs .......... 1668
        Youichiro NIITSU

[Semiconductor Materials and Devices]

 . Effect of SiF4/SiH4/H2 Flow Rates on Film Properties of
   Low-Temperature Polycrystalline Silicon Films Prepared by Plasma
   Enhanced Chemical Vapor Deposition ............................. 1677
        Mikio MOHRI, Hiroaki KAKINUMA and Taiji TSURUOKA

[Recording and Memory Technologies]

 . Measuring System for Optical Disk Mechanical Characteristics ... 1685
        Takashi YOSHIZAWA and Shigeji HARA

[Components]

 . High-Density, High-Pin-Count Flexible SMD Connector for High-Speed
   Data Bus ....................................................... 1694
        Shinichi SASAKI and Tohru KISHIMOTO

LETTERS
=======
[Opto-Electronics]

 . Theoretical Models of Two-Channel Erbium-Doped Fiber Amplifier . 1702
        Shigeyuki SEIKAI and Tatsuo TOHI

[Electromagnetic Theory]

 . Theory of Chemical Waveguides .................................. 1706
        Kazuya HAYATA and Masanori KOSHIBA

 . ABSTRACTS (IEICE Trans., Vol.J77-C-I, J77-C-II, No.10 in Japanese)
            ....................................................... 1710