Technical Committees
- Electromechanical Devices (EMD)
- Magnetic Recording (MRIS)
- Superconducting Electronics (SCE) [Japanese]
- Electronic Information Displays (EID)
- Electron Devices (ED) [Japanese]
- Component Parts and Materials (CPM) [Japanese]
- Electromagnetic Theory (EMT)
- Silicon Devices and Materials (SDM) [Japanese]
- Microwaves (MW)
- Integrated Circuits and Devices (ICD)
- Organic Molecular Electronics (OME) [Japanese]
- Optoelectronics (OPE) [Japanese]
- Lasers and Quantum Electronics (LQE) [Japanese]
- Electronic Simulation Technology (EST) [Japanese]
- Microwave Photonics (MWP)
Workshops
Technical Committees (Term Limited)
- Integrated Photonic Devices and their Applications (IPDA) [Japanese][Feb. 11 - Jan. 13]
- Ultrafast Optoelectronics (UFO) [Japanese][Mar. 11 - Feb. 13]
- Quantum Information Technology (QIT)[Nov. 10 - Nov. 12]
- Terahertz Application Systems (THz)[Apr. 10 - Mar. 12]
- Next Generation Nanotechnology (NNN) [Japanese][Jun. 10 - May 12]
- Polymer Optical Circuit (POC) [Japanese][Apr. 10 - Mar. 12]
- Silicon Photonics (SIPH) [Japanese][Sep. 10 - Aug. 12]
- Technical Group on Ultra-Long Life Digital Storage (ULLDS) [Japanese][Oct. 10 - Sep. 12]
- China-Japan Joint Microwave Conference (CJMW) [Sep. 08 - ]
