The Journal of The Institute of Electronics, Information and Communication Engineers

Special Issue on Jisso Technology Supporting Japanese Manufacturing Industry

Editorial Preface..................................................Yasushi ITOH   911

1.  Electrical Approach for the Jisso Technology
           ..................Yasushi ITOH, Kazuhiko HONJO, and Masayoshi AIKAWA   912

2.  RF MEMS
  2-1  Review of RF MEMS Technologies...............................Koji MIZUNO   919
  2-2  Millimeter-wave Packaging Using MEMS Technologies�FFocusing on Filter Technologies
           ...............Ushio SANGAWA, Michiaki MATSUO, and Kazuaki TAKAHASHI   925
  2-3  RF MEMS Switch.............................................Tomonori SEKI   930
  2-4  Integration of RF MEMS...................................Tamotsu NISHINO   934

3.  Low Cost Packaging Technology
  3-1  Microwave/ Millimeter-wave System-On-Package Technology for Compact Wireless Module
           .................................Kenjiro NISHIKAWA and Tomohiro SEKI   939
  3-2  Millimeter-wave Flip Chip MMICs and Packaging Technology.....Yoji OHASHI   943
  3-3  Development of Quasi Millimeter-wave Transceiver with SMT Package
           ......................................................Masaaki ISHIDA   948

 4.  System Chip
  4-1  Transceiver Circuit Techniques for Mobile Phone Applications
           ....Taizo YAMAWAKI, Satoshi TANAKA, Masumi KASAHARA, and Bob HENSHAW   952
  4-2  RF CMOS Transceiver Technologies for a Bluetooth SoC
           ..................................Kenichi AGAWA and Fumitoshi HATORI   958
  4-3  Future Oriented Antenna Connection Technology to Realize The World's Smallest
        RFID Device of ��-chip...............Mitsuo USAMI and Hironori ISHIZAKA   965
  4-4  SiGe System IC's for Microwave Frequency Range Applications
           ...................................................Noriharu SUEMATSU   970

 5.  Optical Device
  5-1  Ultra-Compact 40-Gbit/s Optical Transmitter Achieved by a Hybrid-Integration of 
        Emitter-Follower-Driving IC and Electro-Absorption Modulator
           ...................Hideo ARIMOTO, Koichi WATANABE, Nobuhiko KIKUCHI,
                            Hideaki TAKANO, Masataka SHIRAI, and Ryoji TAKEYARI   974
  5-2  Assembly Technologies of Uni-Traveling-Carrier Photodiodes (UTC-PDs)
           .........................................................Hiroshi ITO   980
  5-3  Chip to Chip Optical Interconnection Technology..........Kazuhiko KURATA   985

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