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During 2007, IEICE Taipei section co-sponsored three events. The first one is the 2007 International Workshop on Health Risk Analysis and Management of Wireless Communication EMF Exposure, held on Oct. 23rd at National Taiwan University. Six experts on EMF scientific standard, health risk communication, and social management from US, Italy, and Taiwan are invited. This workshop is very successful with more than 200 attendees.
The second event is 2007 IEEE/LEOS Workshop on Fibers and Passive Components, held on Oct. 5th - 7th. Besides eight invited speakers presented latest technologies of fiber passive components, more than 30 papers from several countries are accepted to demonstrate their results in this workshop.
The third event is 2007 IEEE workshop on Electrical Design for Advanced Packaging and Systems, which is held on Dec. 15 to 17 at National Taiwan University. The first day started with three tutorials on Signal Integrity, Power Integrity, and SiP Design, given by Mr. Moises Cases (IBM, USA), Prof. Madhavan Swaminathan (Georgia Tech, USA), and Prof. Joungho Kim (KAIST, Korea), respectively. Totally, 146 attendees have signed in, including around 70 students and 60 engineers from local industry. On the second and third day, there were three featured keynotes, one luncheon talk, and twenty-three invited talks. The three talks were: "Global Paradigms, Models & Challenges" by Prof. Rao R. Tummala (Georgia Tech, USA), "3D Package Technology Integration" by Dr. Ho-Ming Tang (ASE Group, Taiwan), and "Meeting the Design Challenges Associate with SIP and IC/Package/PCB Co-Design" by Dr. Zoltan Cendes (Ansoft, USA). The luncheon talk is "Academic and Industrial Research: Using the IEEE's XPLORE Database" by Dr. Paul Wesling. The invited talks covered the hottest topics including chip/system level design, electromagnetic simulation, electro-thermal analysis, integrated passive devices, as well as efficient yet accurate modeling techniques. The participants came from Canada, Hong Kong, Italy, Japan, Korea, Singapore, Taiwan, and the US (in alphabetical order). The number of attendees reached 271, including 27 invited speakers, which is a new record for EDAPS. Among the attendees, 49% are from academia and 51% from industry, which marks a great success in bridging the academia and industry together.
2007 International Workshop on Health Risk Analysis and Management of Wireless Communication EMF Exposure
2007 IEEE/LEOS Workshop on Fibers and Passive Components
2007 IEEE workshop on Electrical Design for Advanced Packaging and Systems
| Future activities to be organized by the Taipei
Section are listed below: |
| 1. |
2008 International Workshop on Electromagnetic Compatibility (EMC): Four distinguished lecturers in EMC research area will be invited to Taipei Section and have a one-day workshop held on Oct. 10, 2008. The candidate of the speakers will be the IEICE or IEEE fellow and play a leading role in the corresponding research area. More than 100 attendees are estimated to participate in this event. |
| 2. |
2008 International Symposium on Antenna and Propagation: It is a well-known symposium on AP society both in IEEE and IEICE. It will be held on Oct. 23-27, 2008 in Taipei. It is estimated more than 150 papers will be presented and over 400 attendees will join this big events. |
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