It is my great honor and pleasure to welcome you to 2014 International Symposium on Electromagnetic Compatibility Tokyo (EMC’14/Tokyo). This Symposium is the 7th event of the series of EMC Symposium, which has been held every 5 years, celebrating its 30th anniversary this time.

 The Symposium will be devoted to all aspects of EMC technology including EMC Measurements, High Power & High Voltage EMC, EMC Management and Standards, Chip/ Package/PCB/Cables EMC, Immunity & Susceptibility, ESD & Transients, Shielding/Absorbing Materials, Numerical Modeling, EMF Safety & Biomedical issues, Power System EMC, Power Electronics & Vehicles, and Communication Systems EMC.

 Fusion of energy and information in the systems has become a remarkable trend in recent technologies such as “Smart Community”. Wireless power transfer is about to be introduced to the practical use in daily lives. The EMC technology will play important roles in those emerging technologies. We also need to develop effective countermeasures to the threads due to natural sources of disturbance to the systems of our lifeline. Compatibility of systems, regardless of natural or man-made systems, will continue to be the key issue of concerns in our lives.

 During the past five years since the last event of our EMC Symposium, Japan experienced the terrible disaster of the East Japan Earthquake and Tsunami on March 11th in 2011. The experience reminded us of the importance of energy and information systems. We hope EMC technology could make some contribution to the enhancement of reliability of those systems of social infrastructure.

 I, as the chair of EMC'14/Tokyo, sincerely hope that this Symposium will provide all participants with a good opportunity of beneficial information exchange, and person to person communications during not only the technical sessions but also ancillary social events. I also wish all the participants to enjoy a pleasant stay in Tokyo during one of the most beautiful seasons in this city.

 Finally, I would like to express my sincere appreciation to all the supporters of the Symposium for their financial and moral support. I would also like to express my heartfelt gratitude to all the committee members of this symposium for their devoted efforts in making this symposium a great success.

Sincerely,

Prof. Masao Taki
Chairperson
EMC'14/Tokyo